The demand for excellent semiconductor manufacturing for computer chips or semiconductor materials in the communications, electronics, and automotive industries is growing rapidly. The conventional dicing process has become an international standard in chip manufacturing, and the productivity of chip manufacturing is expanding rapidly. Although the dicing process is popular, edge chipping is still a challenge. This study developed a novel ultrasonic dicing blade to solve this problem. The novel ultrasonic dicing blade can generate an amplitude of approximately 0.2–0.8 µm at a resonance frequency of 42–43 kHz. An electromechanical impedance and harmonic analysis method was developed to investigate the vibrational characteristics, such as the resonance frequency, anti-resonance frequency, and radial vibration amplitude. The electromechanical model was suitable for identifying the resonance and anti-resonance frequencies of the ultrasonic dicing blade without an external load. In addition, the simulation amplitude using the harmonic response was effective in identifying the resonance amplitude at a constant damping ratio with a discrepancy error of approximately 5%. Additionally, preliminary dicing process reveals that the novel ultrasonic dicing blade improves the cutting quality of the micro-groove. © The Author(s), under exclusive licence to Springer-Verlag London Ltd., part of Springer Nature 2025.