Ultrasonic Radial Vibration Using Circular Flexure Hinge for Silicon Wafer Dicing Process
Informasi
JurnalJournal of Physics: Conference Series
PenerbitInstitute of Physics
Volume & EdisiVol. 3186,Edisi 1
Halaman -
Tahun Publikasi2026
ISSN17426588
Jenis SumberScopus
Abstrak
This research focuses on the development of an ultrasonic cutting blade with direct contact vibration designed specifically for the dicing process. The main objective is to produce a cutting blade capable of generating radial vibration at its resonance frequency. Finite element analysis was conducted to obtain the radial mode shape of the ultrasonic cutting blade and to determine optimal design parameters that maximize amplitude at the target frequency. The findings indicate that the developed ultrasonic cutting blade achieves its optimal performance at maximum amplitude. The optimal operating parameters identified include the working frequency, amplitude of the radial vibration, and critical flexure hinge dimensions that most significantly influence blade performance. In conclusion, this study introduces the bridge void ratio (BVR) as a design parameter to optimize the amplitude of the circular hinge structure under radial vibration.The maximum amplitude of 0.77 μm was achieved at a BVR value of 0.67. © Published under licence by IOP Publishing Ltd.
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