Effective thermal management is critical for the reliable and efficient operation of electronic devices. This study investigates the thermal optimization of a novel pin fin heat sink design, named the batik heat exchanger (BatiX), inspired by the traditional Indonesian Batik Parang motif. The BatiX design incorporates cultural esthetics into engineering applications, aiming to enhance heat transfer performance while maintaining an esthetically pleasing appearance. Numerical simulations were conducted using COMSOL Multiphysics to evaluate the performance of four geometrical variations of the BatiX design under different Reynolds numbers (8547, 12867, 17174, and 21367) and heat fluxes (18.75 kW/m2 and 31.25 kW/m2). The study employed the (Formula presented.) shear stress transport turbulence model to solve the governing equations for fluid flow and heat transfer under steady-state conditions. Results show that the staggered configuration of the modified BatiX design (Model 4) achieved superior thermal performance, with the highest Nusselt number of 4367 at a Reynolds number of 21367. Model 4 also demonstrated a significant reduction in thermal resistance, achieving the lowest value among all designs tested, highlighting its capability to handle high heat fluxes effectively. The staggered structure improved air mixing, resulting in enhanced convective heat transfer, while the innovative design reduced hot spots and improved temperature uniformity. The novelty of this work lies in the integration of cultural motifs with advanced heat sink design to achieve both functional and esthetic objectives. The findings contribute to the development of efficient and visually appealing heat sinks for electronic cooling applications. Future studies are recommended to explore the addition of perforations to further improve heat transfer performance. © 2025 Taylor & Francis Group, LLC.